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EasyTube™ 3000

Advanced Catalytic CNT and Nanowire CVD System

Download ET 3000 Brochure pdf

Capable of Synthesizing a Myriad of Nanostructures and Thin Film

First Nano’s EasyTube™ 3000 System is the most advanced thermal chemical vapor deposition process tool for nanomaterials synthesis and thin film deposition. EasyTube™ 3000 is capable of synthesizing a myriad of nanostructures and thin film including SWCNT, MWCNT, Graphene, Semiconducting nanowires like Si, Ge, ZnO, GaN, BN, and thin film such as SiGe, SiO2 and Si3N4 using selected combinations of hydrides, liquid and solid precursors. The EasyTube is now being used for materials growth across many industries including nanoelectronics,
semiconductor, photovoltaic, MEMS, composite, and structural coatings, etc

PC Controlled Recipe Driven Software

EasyTube™ 3000 is easy to use with a PC controlled recipe driven software that automatically acquires and logs data for verifiable repeatability.

The graphical user interface (GUI) allows users to logically access preprogrammed recipes, modify and/or create recipes, and view real time execution data.

Innovative Modular Platform

EasyTube™ 3000’s modular platform provides basic key process components and offers enough space to house
several useful options including the loadlock chamber, remote RF plasma, furnace holds batch wafers, rolling
furnace, etc., - all for maximum system flexibility. Options are field upgradeable.

Meets Today's Most Stringent Safety Standards

EasyTube™ 3000 is designed to meet today's most stringent safety standards. The loadlock chamber option further enhances chemical use safety and excludes process chamber contamination from air. The system can safely process most pyrophoric and toxic chemicals
including silane, germane, diborane, phosphine, HCI, and metal organic precursors, etc.

FastCool™ Furnace for High Throughput

The EasyTube™ 3000 offers high throughput. The loadlock chamber option enables fast heating and cooling
by transferring samples between a cold loadlock chamber to a hot process chamber. The fast heating process shows
improved SWCNT quality. The FastCool™ resistance furnace automatically opens at multiple steps during the cooling stage to reduce the cooling time from more than 3 hours to less than 1 hour. With the HotLoad™ and FastCool™ control, a typical CNT process can be finished within 1 hour.

Turn-Key System Capabilities

First Nano offers turn-key system capabilities with support equipment such as Gas Cabinets and Exhaust Gas Conditioning Systems. All major components from one
vendor makes interfacing easy. The First Nano EasyGas™ gas cabinet is capable of delivering a variety of toxic and hazardous gases. The EasyExhaust™ System will
thermally pyrolyze and wet scrub the process effluents.

Our field proven system performance and solid customer base establishes First Nano as the clear choice in leading edge nanotechnology development equipment
for the advanced research facility.

EasyTube™ 3000 Standard Configuration:

  • Windows™ Based Computer Controlled Operations, Data Logging, Safety Interface and Recipe Generation
  • Preprogrammed Recipes for SWCNT, DWCNT, Semiconducting Nanowires, SiGe Thin Film and
    Dielectric Thin Film Growth
  • Resistance Furnace for Temperatures > 1100 °C
  • High Throughput with FastCool™ Furnace
  • Proprietary Real-Time Cascade Process Temperature Control
  • Cantilevered Automatic Loading System
  • 3" Quartz Reaction Chamber
  • Four (4) Mass Flow Controlled UHP Gas Lines
  • User Settable Warnings and Alarms
  • One (1) Year Warranty
  • Comprehensive Software and Hardware Safety Interlocks
  • Semi - S2/S8 and CE® Certified

EasyTube™ 3000 Modular Options:

  • Multi-zone Furnace with Proprietary Real-Time Cascade Process Temperature Control
  • Resistance Heating High Temperature Furnace to
    > 1250 °C
  • Infrared (IR) Heating for Rapid Thermal Processing
    (RTP) > 1150 °C
  • Induction (RF) Heating for Process Temperatures to >1500 °C
  • Low Pressure Operation (100 – 700 torr),
    < 50 mtorr Base Pressure
  • Ultra High Vacuum (UHV) for Loadlock chamber and/or Process Chamber
  • Loadlock for High Throughput
  • Liquid Precursor Vapor Delivery Kit
  • Bubbler Liquid Auto Refill
  • Solid Source Vapor Delivery Kit for Oxide and Nitride Nanowire Growth
  • Rolling Furnace
  • Rectangular Process Tubes for Improved Laminar Gas Flow
  • Wafer Rotation to Improve Growth Uniformity
  • DC Bias Field Assisted Growth
  • Up to Twelve (12) Mass Flow Controlled (UHP) gas lines
  • Residual Gas Analyzer
  • EasyGas™ Hazardous Gas Cabinets, EasyPanel™ (UHP) Gas Panels, EasyExhaust™ Gas Conditioning System
FACILITIES REQUIREMENTS
Electrical 208 V.A.C 3 Phase 40 – 60 AMP
Dimension 96" L
32" W 70" H
(120” L with some options like RF Plasma, 7” tube, rolling furnace, etc.)
Exhaust   500 CFM  
Cooling Water 2 GPM 50-75 PSIG  
Pneumatic Supply Clean Air or N2 80 PSIG  
Facility Nitrogen 20 SLPM 20 PSIG  
Process Gases Customer specified

* Note: Electrical varies with country; facilities requirements vary with system options. Consult Factory for details.

Click for larger view easytube 3000
rf plasma
CNT Batch Synthesis
High Throughput Loader
Infrared Heating Furnace
back of easytube 3000

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